Technical data |
System |
Processor | 13th Generation Intel® Raptor Lake-S Series CPU: - Intel® Core™ i9-13900E 24 Cores Up to 5.2 Ghz, TDP 65W
- Intel® Core™ i7-13700E 16 Cores Up to 5.1 Ghz, TDP 65W
- Intel® Core™ i5-13500E 14 Cores Up to 4.6 Ghz, TDP 65W
- Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W
- Intel® Core™ i3-13100E 4 Cores Up to 4.4 Ghz, TDP 65W
- Intel® Core™ i9-13900TE 24 Cores Up to 5.0 Ghz, TDP 35W
- Intel® Core™ i7-13700TE 16 Cores Up to 4.8 Ghz, TDP 35W
- Intel® Core™ i5-13500TE 14 Cores Up to 4.5 Ghz, TDP 35W
- Intel® Core™ i3-13100TE 4 Cores Up to 4.1 Ghz, TDP 35W
12th Generation Intel® Alder Lake-S Series CPU: - Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W
- Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
- Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
- Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
- Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
- Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
- Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
- Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
- Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
- Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
- Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
- Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W
|
Chipset | Intel H610E Chipset |
Memory | 1x DDR5 4800MHz SO-DIMM Socket Supports Un-buffered and non-ECC Type, Up to 32GB |
BIOS | AMI BIOS |
Graphics |
Graphics Engine | - Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
- Integrated Intel® UHD Graphics 730: Core™ i3
- Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
|
Maximum Display Output | Supports Triple Independent Display |
DP | 1x DisplayPort Connector: 3840 x 2160 @60Hz |
VGA | 1x VGA Connector: 1920 x 1200 @60Hz |
CMI Display | 1x CMI Interface for Optional CMI-DP/CMI-HDMI Module Expansion |
Audio |
Audio Codec | Realtek ALC888, High Definition Audio |
Line-out | 1 x Line-out, Phone Jack 3.5mm |
Mic-in | 1 x Mic-in, Phone Jack 3.5mm |
I/O |
LAN | 1x 2.5GbE LAN, RJ45 1x 1GbE LAN, RJ45 |
COM | 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 |
USB | - 1x 10Gbps USB3.2 Gen 2x1, Type A
- 2x 5Gbps USB3.2 Gen 1x2, Type A
- 3x 480Mbps USB2.0, Type A
|
Storage |
SSD/HDD | 1x 2.5" SATA HDD/SSD Bay (SATA 3.0) |
M.2 SSD | - 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4x4 NVMe SSD or SATA 3.0 SSD
- 2x M.2 SSD Shared by M.2 Key B Socket, Support PCIe Gen 3x2 NVMe SSD or SATA 3.0 SSD
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Expansion |
M.2 Key E Socket | 1x M.2 Key E Type 2230 Socket, Support Wireless/Intel CNVi Module Expansion |
M.2 Key B Socket | - 1x M.2 Key B Type 3042/3052 Socket, Support 5G/Storage/Add-on Card Expansion
- 1x M.2 Key B Type 2242 Socket, Support Storage/Add-on Card Expansion
|
SIM Socket | 1x Front Accessible SIM Socket |
CMI (Combined Multiple I/O) Interface | - 1x CMI Interface for optional CMI-Display Module Expansion
- 2x CMI Interface for optional CMI-COM/DIO Module Expansion
|
CFM (Control Function Module) Interface | 1x CFM IGN Interface for optional CFM-IGN Module Expansion |
Other Function |
External FAN Connector | 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
Clear CMOS Switch | 1 x Clear CMOS Switch |
Reset Button | 1x Reset Button |
Instant Reboot | Support 0.2sec Instant Reboot Technology |
Watchdog Timer | Software Programmable Supports 256 Levels System Reset |
Antenna Hole | 5x Antenna Holes |
Power | Power Button | 1x ATX Power On/Off Button |
Power Mode Switch | 1x AT/ATX Mode Switch |
Power Input | 9 - 48VDC, 3-pin Terminal Block |
Remote Power On/Off | 1x Remote Power On/Off, 2-pin Terminal Block |
Remote Power LED | 1x Remote Power LED, 2-pin Terminal Block |
Operating Stystem |
Microsoft® Windows® | Windows®10 |
Linux | Supports by project |
Physical |
Dimension ( W x D x H ) | 224.1 x 162 x 62 mm |
Weight | 2.52 kg |
Mechanical Construction | Extruded Aluminum with Heavy Duty Metal |
Mounting | Wall / DIN-RAIL / VESA Mount |
Physical Design | - Fanless Design
- Cableless Design
- Jumper-less Design
- Unibody Design
|
Reliability & Protection |
Reverse Power Input | Yes |
Over Current Protection | 15A |
CMOS Battery Backup | SuperCap Integrated for CMOS Battery Maintenance-free Operation |
MTBF | TBC Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3
|
Environment |
Operating Temperature | - 35W TDP Processor: -40øC to 70øC
- 65W TDP Processor: TBC (With External Fan Kit)
- BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
- ith extended temperature peripherals; Ambient with air flow
- ccording to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
|
Storage Temperature | TBC |
Relative Humidity | TBC |
Shock | MIL-STD-810H |
Vibration | MIL-STD-810H |
EMC | - CE, UKCA, FCC, ICES-003 Class A
- EN61000-6-4, EN61000-6-2 (24VDC Input Only)
- EN 50155 (EN 50121-3-2 Only)
- E-mark (Pending)
|
EMI | - CISPR 32 Conducted & Radiated: Class A
- EN/BS EN 55032 Conducted & Radiated: Class A
- EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
- EN/BS EN61000-3-3 Voltage fluctuations & flicker
- FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
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EMS | - EN/IEC 61000-4-2 ESD: Contact: 4 kV; Air: 8 kV
- EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 10 V/m
- EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 1 kV; Signal: 1 kV
- EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV
- EN/IEC 61000-4-6 CS: 10V
(**Compliant with the standard when utilizing shielded ethernet cable.) - EN/IEC 61000-4-8 PFMF: 50 Hz, 30A/m
- EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz
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